Title :
Barriers in total productive maintenance implementation in a semiconductor manufacturing firm: A case study
Author :
Ng, K.C. ; Goh, G.G.G. ; Eze, Uchenna C.
Author_Institution :
Infineon Technol., Melaka, Malaysia
Abstract :
As most organizations have to simultaneously meet various stakeholders requirements related to quality, cost, delivery and safety aspects these organizations must be driven by both effective and efficient operation strategies in order to fulfill the stakeholders´ demand. One of the approaches to improve the production performance is to develop and implement total productive maintenance. Total productive maintenance (TPM) is a world-class manufacturing strategy which leading manufacturing very near to ideal condition with zero down time, zero defect, lean production, just-in-time production (JIT) and competitive cost leader in order to gain competitive advantage. TPM is a well-known innovative approach to maintenance strategy which holds the potential for improve overall equipment effectiveness. The findings of this research reveal key barriers of a successful TPM implementation such as lack of long-term commitment from the top management, lack of competent resources, lack of buy-in from shop floor staff, increase production operator´s job load, lack of cultural change, inability of the organization to coordinate its shop floor, and inadequate communication and awareness.
Keywords :
just-in-time; lean production; maintenance engineering; semiconductor industry; TPM implementation; competent resources; competitive cost leader; costing; cultural change; just-in-time production; lean production; long-term commitment; manufacturing strategy; production operator job load; production performance improvement; quality aspects; safety aspects; semiconductor manufacturing firm; shop floor staff; stakeholders requirements; top management; total productive maintenance implementation; zero defect; zero down time; Companies; Maintenance engineering; Manufacturing; Production; Training; Total productive maintenance; case study; key barriers or pitfalls;
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2012 IEEE International Conference on
Conference_Location :
Hong Kong
DOI :
10.1109/IEEM.2012.6837765