• DocumentCode
    691185
  • Title

    The Coupling Structure Modal Analysis of PVDF Piezoelectric Wafer Oscillator

  • Author

    Jinchuan Han ; Zhou Wan ; Li Cheng ; Xingzhi Liao ; Lin He

  • Author_Institution
    Fac. of Inf. Eng. & Autom., Kunming Univ. of Sci. & Technol., Kunming, China
  • fYear
    2013
  • fDate
    21-23 Sept. 2013
  • Firstpage
    1253
  • Lastpage
    1256
  • Abstract
    PVDF piezoelectric materials are widely used because of its good performance, but the structure of this material is thinner, and there exits the shear locking problems when analyzing force electric coupling, therefore, the basic research of piezoelectric properties also has certain limitations. In order to solve the above problems, this paper introduced the idea that makes a coupled modal analysis on PVDF by finite element analysis with ANSYS, and chooses a piezoelectric coupled finite element unit analysis as SOLID5. After exerting the corresponding coupling constraints, this paper gets a variety of modal frequencies and mode shapes, and it shows that this method solves the coupling problems. To some extent it provides the basis for the structure design of PVDF sensor, to avoid a specific frequency vibration or resonance vibration.
  • Keywords
    electric sensing devices; finite element analysis; modal analysis; piezoelectric devices; piezoelectric materials; piezoelectric oscillations; piezoelectricity; vibrational modes; ANSYS; PVDF piezoelectric materials; PVDF piezoelectric wafer oscillator; PVDF sensor; SOLID5; coupling constraint; coupling structure modal analysis; force electric coupling analysis; modal frequency; mode shape; piezoelectric coupled finite element unit analysis; shear locking problem; structure design; Couplings; Finite element analysis; Modal analysis; Oscillators; Piezoelectric materials; Vibrations; ANSYS; PVDF; coupling; modal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
  • Conference_Location
    Shenyang
  • Type

    conf

  • DOI
    10.1109/IMCCC.2013.278
  • Filename
    6840668