DocumentCode :
691185
Title :
The Coupling Structure Modal Analysis of PVDF Piezoelectric Wafer Oscillator
Author :
Jinchuan Han ; Zhou Wan ; Li Cheng ; Xingzhi Liao ; Lin He
Author_Institution :
Fac. of Inf. Eng. & Autom., Kunming Univ. of Sci. & Technol., Kunming, China
fYear :
2013
fDate :
21-23 Sept. 2013
Firstpage :
1253
Lastpage :
1256
Abstract :
PVDF piezoelectric materials are widely used because of its good performance, but the structure of this material is thinner, and there exits the shear locking problems when analyzing force electric coupling, therefore, the basic research of piezoelectric properties also has certain limitations. In order to solve the above problems, this paper introduced the idea that makes a coupled modal analysis on PVDF by finite element analysis with ANSYS, and chooses a piezoelectric coupled finite element unit analysis as SOLID5. After exerting the corresponding coupling constraints, this paper gets a variety of modal frequencies and mode shapes, and it shows that this method solves the coupling problems. To some extent it provides the basis for the structure design of PVDF sensor, to avoid a specific frequency vibration or resonance vibration.
Keywords :
electric sensing devices; finite element analysis; modal analysis; piezoelectric devices; piezoelectric materials; piezoelectric oscillations; piezoelectricity; vibrational modes; ANSYS; PVDF piezoelectric materials; PVDF piezoelectric wafer oscillator; PVDF sensor; SOLID5; coupling constraint; coupling structure modal analysis; force electric coupling analysis; modal frequency; mode shape; piezoelectric coupled finite element unit analysis; shear locking problem; structure design; Couplings; Finite element analysis; Modal analysis; Oscillators; Piezoelectric materials; Vibrations; ANSYS; PVDF; coupling; modal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
Conference_Location :
Shenyang
Type :
conf
DOI :
10.1109/IMCCC.2013.278
Filename :
6840668
Link To Document :
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