• DocumentCode
    691424
  • Title

    Thermal aware power gated design

  • Author

    Choudhury, Pallab ; Pradhan, S.N.

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol. Agartala, Agartala, India
  • fYear
    2013
  • fDate
    20-21 Sept. 2013
  • Firstpage
    126
  • Lastpage
    130
  • Abstract
    High packing density increases the power consumption and consequently may increase the power density of the VLSI circuit. As heat generation is proportional to the power density, chip temperature increases with the increase of the power density. Again as area increases, power density decreases i.e, power density will be least when area will be maximum and power will be minimum. So, there is a trade off between area and power density. In this paper genetic algorithm based approach has been adopted to optimize both the area and power density of the circuit. Sometimes, power optimized circuit may have large area. So, there is trade off among area, power and power density also. Optimization of these three parameters has also been considered in this paper.
  • Keywords
    VLSI; circuit optimisation; genetic algorithms; integrated circuit packaging; power consumption; thermal management (packaging); VLSI circuit; chip temperature; genetic algorithm; heat generation; high packing density; power consumption; power density; thermal aware power gated design; Genetic Algorithm; Partitioning; Power Gating; State encoding;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Communication and Computing (ARTCom 2013), Fifth International Conference on Advances in Recent Technologies in
  • Conference_Location
    Bangalore
  • Print_ISBN
    978-1-84919-842-4
  • Type

    conf

  • DOI
    10.1049/cp.2013.2214
  • Filename
    6842980