DocumentCode
691424
Title
Thermal aware power gated design
Author
Choudhury, Pallab ; Pradhan, S.N.
Author_Institution
Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol. Agartala, Agartala, India
fYear
2013
fDate
20-21 Sept. 2013
Firstpage
126
Lastpage
130
Abstract
High packing density increases the power consumption and consequently may increase the power density of the VLSI circuit. As heat generation is proportional to the power density, chip temperature increases with the increase of the power density. Again as area increases, power density decreases i.e, power density will be least when area will be maximum and power will be minimum. So, there is a trade off between area and power density. In this paper genetic algorithm based approach has been adopted to optimize both the area and power density of the circuit. Sometimes, power optimized circuit may have large area. So, there is trade off among area, power and power density also. Optimization of these three parameters has also been considered in this paper.
Keywords
VLSI; circuit optimisation; genetic algorithms; integrated circuit packaging; power consumption; thermal management (packaging); VLSI circuit; chip temperature; genetic algorithm; heat generation; high packing density; power consumption; power density; thermal aware power gated design; Genetic Algorithm; Partitioning; Power Gating; State encoding;
fLanguage
English
Publisher
iet
Conference_Titel
Communication and Computing (ARTCom 2013), Fifth International Conference on Advances in Recent Technologies in
Conference_Location
Bangalore
Print_ISBN
978-1-84919-842-4
Type
conf
DOI
10.1049/cp.2013.2214
Filename
6842980
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