• DocumentCode
    692849
  • Title

    A test probe for TSV using resonant inductive coupling

  • Author

    Rashidzadeh, R. ; Basith, Iftekhar

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Windsor, Windsor, ON, Canada
  • fYear
    2013
  • fDate
    6-13 Sept. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
  • Keywords
    equivalent circuits; integrated circuit testing; three-dimensional integrated circuits; contactless TSV probe; distance 15 mum; equivalent circuits; resonant inductive coupling; test probe; through-silicon-via; Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2013.6874619
  • Filename
    6874619
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=692849