Title :
Symmetric 40-Gb/s TWDM-PON With 39-dB Power Budget
Author :
Lilin Yi ; Zhengxuan Li ; Meihua Bi ; Wei Wei ; Weisheng Hu
Author_Institution :
Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Time- and wavelength-division multiplexed passive optical network (TWDM-PON) has been selected by full service access networks as a primary solution for next generation PON stage 2 in April 2012. In this letter, we propose and demonstrate a symmetric 40-Gb/s TWDM-PON with 39-dB power budget. A reflective semiconductor optical amplifier is used in optical network unit as a pre-amplifier to enhance the sensitivity of downstream signals. For the upstream direction, a thermally-tuned directly modulated laser with 10-Gb/s modulation rate is used as upstream colorless source, and a chirp management filter is employed in optical line terminal to mitigate chromatic dispersion therefore enabling fiber transmission. Symmetric 40-Gb/s TWDM-PON is experimentally demonstrated with a power budget of 39 dB, which could support 25-km fiber transmission and 1:1000 splitting ratio.
Keywords :
next generation networks; optical fibre dispersion; optical filters; passive optical networks; semiconductor optical amplifiers; time division multiplexing; wavelength division multiplexing; bit rate 10 Gbit/s; bit rate 40 Gbit/s; chirp management filter; chromatic dispersion; distance 25 km; fiber transmission; full service access networks; next generation PON; optical line terminal; power budget; pre-amplifier; semiconductor optical amplifier; symmetry TWDM-PON; thermally-tuned directly modulated laser; time-division multiplexed passive optical network; upstream colorless source; wavelength-division multiplexed passive optical network; Chirp; Optical fiber filters; Optical network units; Optical transmitters; Passive optical networks; Sensitivity; Chirp management filter; directly modulated laser (DML); power budget; time- and wavelength-division multiplexed passive optical network (TWDM-PON);
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2013.2246151