DocumentCode
693829
Title
Unified Padring Design Flow - New Developments and Results
Author
Ang Boon Chong ; Ho Kah Chun
Author_Institution
Design Service, PMC-Sierra, Minden, Malaysia
fYear
2013
fDate
3-5 Dec. 2013
Firstpage
462
Lastpage
466
Abstract
In the early design phase, padring design is one of the critical elements in design planning. The result from padring design not only will impact packaging, board level design, power integrity and signal integrity result, but also the overall product cost. In the past, padring design is often done through separate standalone tool like Orbit IO or internal excel estimation spreadsheet. The intend of this paper is to share the unified padring design methodology where single design database is referenced hence padring design will always be in sync with full chip backend database. Unified padring flow allows consistent cross functional review reference point as well as better controllability for core and padring design integration. Hopefully the methodology proposed will benefit the padring designers in floor planning and product cost estimation through unified padring flow.
Keywords
costing; electronic engineering computing; integrated circuit design; packaging; Orbit IO; board level design; chip backend database; design database; design planning; floor planning; internal excel estimation spreadsheet; packaging; pad ring design integration; pad ring designers; power integrity; product cost estimation; signal integrity; unified pad ring design flow; Chip scale packaging; Databases; Optimization; Packaging; Planning; Routing; Synchronization; ASIC Padring Design; Padring;
fLanguage
English
Publisher
ieee
Conference_Titel
Artificial Intelligence, Modelling and Simulation (AIMS), 2013 1st International Conference on
Conference_Location
Kota Kinabalu
Print_ISBN
978-1-4799-3250-4
Type
conf
DOI
10.1109/AIMS.2013.84
Filename
6959962
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