• DocumentCode
    694208
  • Title

    An enhancement for single sampling plan method

  • Author

    Kang, Sheng Randy ; Yan-Ju, Lisa-Yu ; Chien, Wei-ting Kary

  • Author_Institution
    Dept. of SQE, SMIC, Shanghai, China
  • fYear
    2013
  • fDate
    10-13 Dec. 2013
  • Firstpage
    1174
  • Lastpage
    1178
  • Abstract
    Acceptance sampling has been widely used as a quality control technique in industry. A standard single sampling plan consists of 3 switchable inspection plans: Tightened, Normal and Reduced [1]. It means the 3 inspection schemes can be switched from one to another based on predetermined successive products´ quality. Theoretically, higher quality of successive lots or batches has high probability of acceptance, and vice versa, lower quality of products will suffer from high reject ratio. However, how about the switch rule works? How to adjust the switch rule to meet requirements of manufacturing and cost? In this paper, we simulate the acceptance probability with different class of defects or defectives in a standard single sampling plan using a self-developed program. And using this program, we investigate the actual inspection cost and both producers´ and consumers´ risk with a variety of switch rule. An optimized single sampling plan is proposed based on the results of design of experiment (DOE). The sampling plan is more economic and effective to manufactories.
  • Keywords
    design of experiments; inspection; product quality; quality control; sampling methods; acceptance probability; acceptance sampling; defects; design of experiment; inspection; product quality; quality control; single sampling plan method; Industries; Inspection; Market research; Quality control; Software; Standards; Switches; AQL (Acceptable Quality Limit); Sampling Acceptance; customer´s risk; design of experiment; operating characteristic curve; producer´s risk; sampling plan;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2013 IEEE International Conference on
  • Conference_Location
    Bangkok
  • Type

    conf

  • DOI
    10.1109/IEEM.2013.6962596
  • Filename
    6962596