• DocumentCode
    695308
  • Title

    Physical verification flow for hierarchical analog ic design constraints

  • Author

    Meyer zu Bexten, Volker ; Tristl, Markus ; Jerke, Goran ; Marquardt, Hartmut ; Medhat, Dina

  • Author_Institution
    Infineon Technol. AG, Neubiberg, Germany
  • fYear
    2015
  • fDate
    19-22 Jan. 2015
  • Firstpage
    447
  • Lastpage
    453
  • Abstract
    Design constraints describe the intent of IC designers when developing electronic circuits. Constraints from, e.g., electrical and thermal domains are transformed into corresponding physical constraints for layout design. Physical constraints can also be derived from circuit patterns or extracted layout netlists. The constraint verification is of utmost importance to guarantee the intended function of the final IC. Individual constraints often span multiple hierarchy levels, thus requiring a fully hierarchical verification approach. A novel, modular, and extensible industrial-strength approach is presented to (1) derive analog-focused design constraints from an existing circuit or extracted layout netlist, and (2) verify analog constraints such as clustering, matched orientation, matched parameters, alignment, and symmetry across multiple design hierarchy levels. Experimental results for real-world automotive IC designs demonstrate its feasibility.
  • Keywords
    analogue integrated circuits; formal verification; integrated circuit design; analog-focused design constraints; clustering; electronic circuits; hierarchical analog IC design constraints; layout design; layout netlist; matched orientation; matched parameters; multiple design hierarchy levels; physical verification flow; real-world automotive IC designs; Context; Databases; Integrated circuits; Layout; Pattern matching; Shape; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2015 20th Asia and South Pacific
  • Conference_Location
    Chiba
  • Print_ISBN
    978-1-4799-7790-1
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2015.7059047
  • Filename
    7059047