• DocumentCode
    702255
  • Title

    GlYFF: A framework for global yield and floorplan aware design optimization

  • Author

    Shuo Wang ; Yue Gao ; Breuer, Melvin A.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2015
  • fDate
    2-4 March 2015
  • Firstpage
    70
  • Lastpage
    76
  • Abstract
    Diminishing yields for modern CMOS and emerging technologies have become a major growing concern for IC manufacturers due to its direct impact on revenue. To this end, “Design for Yield (DFY)” have been proposed to proactively address manufacturing yield issues in the system design stage. While many DFY approaches have been developed for caches, GPUs and CPUs, they remain decoupled from each other, which is not ideal for modern microprocessors or MPSoCs that integrate multiple components onto a single die. In this paper we introduce “Global Yield and Floorplan Aware Design Optimization Framework (GlYFF)”, a holistic computer-aided DFY framework that unifies redundancy based yield-centric design optimizations and floorplanning for MP-SoCs. GlYFF recognizes the different yield enhancement strategies for different on-die components, and is able to output detailed floorplans for accurate area/performance measurements. We demonstrate that compared to a segregated DFY methodology, GlYFF can achieve ~20% improvement in yield-per-area, a metric strongly correlated to revenue.
  • Keywords
    circuit CAD; circuit optimisation; integrated circuit layout; integrated circuit yield; CMOS; GlYFF; computer aided DFY; design for yield; floorplan aware design optimization; global yield aware design optimization; Design optimization; Graphics processing units; Measurement; Multicore processing; Redundancy; System-on-chip; Yield estimation; Design for yield; floor plan; hardware redundancy insertion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2015 16th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-7580-8
  • Type

    conf

  • DOI
    10.1109/ISQED.2015.7085401
  • Filename
    7085401