Title :
Impact of geometry parameter on electromigration reliability in FCBGA package
Author :
Lihua Liang ; Yuanxiang Zhang ; Rao, Richard
Author_Institution :
Coll. of Mech. Eng., Zhejiang Univ. of Technol., Hangzhou, China
Abstract :
Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. A practical method of atomic density integral (ADI) for predicting solder bump electromigration reliability is proposed in this paper by considering the driving forces of electron wind force, stress gradients, temperature gradients, as well as atomic density gradient. The electromigration simulation is performed on FCBGA package based on ADI method, and the simulation results for void generation and time to failure (TTF) have a reasonably good correlation with the testing results. Orthogonal experimental design has been used to evaluate the effect of design parameter on TTF of electromigration. Based on this study, some practical recommendations are made to optimize the package design and improve the solder bump electromigration reliability.
Keywords :
ball grid arrays; electromigration; integrated circuit packaging; integrated circuit reliability; solders; FCBGA package; atomic density gradient; atomic density integral; electromigration simulation; electron wind force; geometry parameter impact; microelectronic packaging; orthogonal experimental design; solder bump electromigration reliability; solder joints; stress gradients; temperature gradients; Current density; Electromigration; Heating; Mathematical model; Reliability; Stress; Temperature distribution; FCBGA package; atomic density integral method; electromigration; orthogonal experimental design; time to failure;
Conference_Titel :
Quality Electronic Design (ISQED), 2015 16th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-7580-8
DOI :
10.1109/ISQED.2015.7085446
