• DocumentCode
    702320
  • Title

    Technology/circuit co-optimization and benchmarking for graphene interconnects at Sub-10nm technology node

  • Author

    Chenyun Pan ; Raghavan, Praveen ; Catthoor, Francky ; Tokei, Zsolt ; Naeemi, Azad

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2015
  • fDate
    2-4 March 2015
  • Firstpage
    599
  • Lastpage
    603
  • Abstract
    In this paper, graphene interconnects are analyzed based on realistic circuits in terms of multiple material properties, such as the mean free path, the contact resistance, and the edge roughness. The benchmark against conventional copper wires shows that the advantage of graphene usage occurs only under certain circumstances. The device-level parameters, including the supply and threshold voltages, and the circuit-level parameters, including the wire length and width, have large impacts on both the delay and energy-delay product (EDP) comparisons. Two representative circuits, a 32-bit adder and an SRAM, are investigated. Up to 40% and 70% of the improvement in delay and EDP are observed for a 32-bit adder. For the SRAM application, contact resistance is a crucial factor in dictating the performance of graphene interconnects.
  • Keywords
    SRAM chips; adders; circuit optimisation; contact resistance; copper; graphene devices; integrated circuit interconnections; SRAM; adder; circuit cooptimization; circuit-level parameters; contact resistance; copper wires; device-level parameters; energy-delay product; graphene interconnects; storage capacity 32 bit; threshold voltages; wire length; wire width; Capacitance; Copper; Delays; Graphene; Integrated circuit interconnections; Resistance; Wires; 32-bit adder; Multi-layer graphene interconnect; SRAM; circuit-level simulation; delay; energy-delay product; performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2015 16th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-7580-8
  • Type

    conf

  • DOI
    10.1109/ISQED.2015.7085495
  • Filename
    7085495