DocumentCode :
704082
Title :
DESTINY: A tool for modeling emerging 3D NVM and eDRAM caches
Author :
Poremba, Matt ; Mittal, Sparsh ; Dong Li ; Vetter, Jeffrey S. ; Yuan Xie
Author_Institution :
Pennsylvania State Univ., University Park, PA, USA
fYear :
2015
fDate :
9-13 March 2015
Firstpage :
1543
Lastpage :
1546
Abstract :
The continuous drive for performance has pushed the researchers to explore novel memory technologies (e.g. nonvolatile memory) and novel fabrication approaches (e.g. 3D stacking) in the design of caches. However, a comprehensive tool which models both conventional and emerging memory technologies for both 2D and 3D designs has been lacking. We present DESTINY, a microarchitecture-level tool for modeling 3D (and 2D) cache designs using SRAM, embedded DRAM (eDRAM), spin transfer torque RAM (STT-RAM), resistive RAM (ReRAM) and phase change RAM (PCM). DESTINY facilitates design-space exploration across several dimensions, such as optimizing for a target (e.g. latency or area) for a given memory technology, choosing the suitable memory technology or fabrication method (i.e. 2D v/s 3D) for a desired optimization target etc. DESTINY has been validated against industrial cache prototypes. We believe that DESTINY will drive architecture and system-level studies and will be useful for researchers and designers.
Keywords :
DRAM chips; SRAM chips; cache storage; memory architecture; phase change memories; resistive RAM; 3D NVM modeling; 3D cache design modeling; DESTINY; PCM; ReRAM; SRAM; STT-RAM; design space exploration; eDRAM cache; embedded DRAM; fabrication method; microarchitecture level tool; phase change RAM; resistive RAM; spin transfer torque RAM; Integrated circuit modeling; Nonvolatile memory; Prototypes; Random access memory; Solid modeling; Stacking; Three-dimensional displays; Cache; PCM; ReRAM; SRAM; STT-RAM; eDRAM; modeling tool; non-volatile memory (NVM or NVRAM); validation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015
Conference_Location :
Grenoble
Print_ISBN :
978-3-9815-3704-8
Type :
conf
Filename :
7092634
Link To Document :
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