• DocumentCode
    704180
  • Title

    Ctherm: An Integrated Framework for Thermal-Functional Co-simulation of Systems-on-Chip

  • Author

    Kumar, Sumeet S. ; Zjajo, Amir ; van Leuken, Rene

  • Author_Institution
    Circuits & Syst. Group, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2015
  • fDate
    4-6 March 2015
  • Firstpage
    674
  • Lastpage
    681
  • Abstract
    This paper presents therm, an integrated framework for cycle-accurate thermal and functional evaluation of systems-on-chip. The presented framework enables accurate characterization of thermal behaviour by generating detailed physical models for components based on input specifications, and simulating them within a tightly integrated co-simulation platform with an embedded thermal simulator. Therm´s fine-grained modelling approach yields 70% higher accuracy in hotspot resolution as compared to conventional approaches that abstract component internals. Simulation runtime time is reduced by up to 36% over conventional continuous approaches through the use of thermal check pointing, enabling the fast-forwarding of thermal simulations without loss of thermal continuity.
  • Keywords
    checkpointing; performance evaluation; system-on-chip; Ctherm fine-grained modelling approach; abstract component internals; cycle-accurate functional evaluation; cycle-accurate thermal evaluation; embedded thermal simulator; hotspot resolution; integrated thermal-functional cosimulation framework; systems-on-chip; thermal behaviour; thermal checkpointing; thermal continuity; thermal simulations; Computational modeling; Organizations; Solid modeling; System-on-chip; Three-dimensional displays; Through-silicon vias; Topology; Design Space Exploration; Multiprocessors; System-on-chip; SystemC; Thermal Management; Thermal-aware Design; Three-dimensional Integrated Circuits; Virtual Prototyping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel, Distributed and Network-Based Processing (PDP), 2015 23rd Euromicro International Conference on
  • Conference_Location
    Turku
  • ISSN
    1066-6192
  • Type

    conf

  • DOI
    10.1109/PDP.2015.56
  • Filename
    7092792