DocumentCode :
704612
Title :
Device bias technique to improve design metrics of 6T SRAM cell for subthreshold operation
Author :
Pal, Soumitra ; Islam, Aminul
Author_Institution :
Birla Inst. of Technol., Electron. & Commun. Eng., Ranchi, India
fYear :
2015
fDate :
19-20 Feb. 2015
Firstpage :
865
Lastpage :
870
Abstract :
At present day SRAM cell is under renewal stage. Researchers are aiming to get an SRAM cell which is reliable and robust against process, voltage and temperature (PVT) fluctuations. An SRAM cell is also expected to support low-power applications. This article proposes a new way for designing an SRAM cell. The proposed cell functions properly even bellow subthreshold region. Therefore, it can be useful for ultralow-power applications. Robustness/reliability of the proposed design is investigated by estimating read static noise margin (RSNM). The estimated results are compared with its conventional counterpart. The proposed 6T SRAM cell offers 1.83× faster read operation. It is also less affected by PVT fluctuations (by 1.47×) during read operation compared to conventional 6T SRAM cell. The proposed SRAM cell exhibits 1.40× higher RSNM compared to conventional 6T SRAM cell, proving its reliability during read operation. It also shows 3.86% faster write operation. It is 18.4% less affected by PVT fluctuations. It has 2.33% higher write static noise margin (WSNM) than the conventional 6T SRAM cell.
Keywords :
SRAM chips; low-power electronics; semiconductor device reliability; 6T SRAM cell; PVT; RSNM; WSNM; device bias technique; process voltage and temperature; read static noise margin; subthreshold operation; ultralow-power applications; write static noise margin; Delays; Fluctuations; Robustness; SRAM cells; Threshold voltage; Transistors; CMOS; DTMOS mechanism; Read Delay; Read Stability; Write Delay; Write-Ability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Processing and Integrated Networks (SPIN), 2015 2nd International Conference on
Conference_Location :
Noida
Print_ISBN :
978-1-4799-5990-7
Type :
conf
DOI :
10.1109/SPIN.2015.7095170
Filename :
7095170
Link To Document :
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