• DocumentCode
    70707
  • Title

    Effective Electrothermal Analysis of Electronic Devices and Systems with Parameterized Macromodeling

  • Author

    Ferranti, Francesco ; Magnani, Alessandro ; d´Alessandro, Vincenzo ; Russo, Salvatore ; Rinald, Niccolo ; Dhaene, Tom ; de Magistris, Massimiliano

  • Author_Institution
    Dept. of Fundamental Electr. & Instrum., Vrije Univ. Brussel, Brussels, Belgium
  • Volume
    5
  • Issue
    6
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    788
  • Lastpage
    796
  • Abstract
    We propose a parameterized macromodeling methodology to effectively and accurately carry out dynamic electrothermal (ET) simulations of electronic components and systems, while taking into account the influence of key design parameters on the system behavior. In order to improve the accuracy and to reduce the number of computationally expensive thermal simulations needed for the macromodel generation, a decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed. The approach is applied to study the impact of layout variations on the dynamic ET behavior of a state-of-the-art 8-finger AlGaN/GaN high-electron mobility transistor grown on a SiC substrate. The simulation results confirm the high accuracy and computational gain obtained using parameterized macromodels instead of a standard method based on iterative complete numerical analysis.
  • Keywords
    III-V semiconductors; aluminium compounds; decomposition; frequency-domain analysis; gallium compounds; high electron mobility transistors; impedance matrix; iterative methods; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; SiC; decomposition; dynamic ET simulation; dynamic electrothermal simulation; electronic device; electrothermal analysis; frequency-domain data sampling; high-electron mobility transistor; iterative complete numerical analysis; parameterized macromodeling methodology; thermal impedance matrix; Accuracy; Computational modeling; Data models; Estimation; Impedance; Integrated circuit modeling; Numerical models; Compact thermal modeling; electrothermal (ET) simulation; equivalent network; parameterized macromodeling; thermal feedback (TF); thermal impedance; transient analysis; transient analysis.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2429147
  • Filename
    7110377