• DocumentCode
    707312
  • Title

    Statistical analysis of defect removal effectiveness to improve the software quality and reducing the estimated cost

  • Author

    Marandi, Arun Kumar ; Khan, Danish Ali

  • Author_Institution
    Dept. of Comput. Applic., Nat. Inst. of Technol., Jamshedpur, India
  • fYear
    2015
  • fDate
    11-13 March 2015
  • Firstpage
    509
  • Lastpage
    513
  • Abstract
    Software companies need to reduce their estimated cost for surviving the business world. Now the present scenario software industries faces with greater competitive pressures and skyrocketing costs of software breakdown, to push high quality software within their limits to achieve new heights. Software quality and reducing the estimated cost, in this approach method for finding the solution of parameters in linear regression models with cost estimating method. It describes the approach of software and cost analysis with historical project data. In this methodology, Software quality model can make timely predictions of reliability indications; it´s enabling to improve software development processes by target reducing the estimated cost for software products and improve the techniques for more effectively and efficiently.
  • Keywords
    regression analysis; software cost estimation; software quality; software reliability; cost estimating method; cost reduction; historical project data; linear regression models; reliability indications; software companies; software development processes; software industries; software products; software quality improvement; statistical analysis; Analytical models; Biological system modeling; Mathematical model; Software quality; Statistical analysis; Testing; cost estimation; defect injection; defect removal; defect tracking; linear regression model; quality management; software quality; statistical analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computing for Sustainable Global Development (INDIACom), 2015 2nd International Conference on
  • Conference_Location
    New Delhi
  • Print_ISBN
    978-9-3805-4415-1
  • Type

    conf

  • Filename
    7100302