Title :
Evaluation of scalable 3-D Network on Chip architectures
Author :
Tyagi, Sapna ; Agarwal, Amit
Author_Institution :
Dept. of Comput. Sci., Inst. of Manage. Studies, Ghaziabad, India
Abstract :
The increase growth of VLSI technology and consumer demand has enabled future System-on-Chip (SoC) systems to integrate up to several hundreds of cores within a single chip. Due to such enormous integration density and complexity of the system-on-Chip (SoC), the conventional architectures are not suitable to fulfill the demand and scalability issues. The application of traditional network technologies in the form of Network-on-Chip is a potential solution; however it suffers from high speed. In this paper, we have discussed evaluated and proposed some 3-Dimensional scalable architecture for Network-on-Chip that has reduce diameter and degree.
Keywords :
VLSI; integration; network-on-chip; three-dimensional integrated circuits; 3-dimensional scalable architecture; SoC systems; VLSI technology; consumer demand; degree reduction; diameter reduction; integration density; scalable 3D network-on-chip architecture evaluation; single chip; system-on-chip systems; Bandwidth; Computer architecture; Network topology; Routing; System-on-chip; Topology; Wires; 3-D; NoC; SoC; Topology; VLSI;
Conference_Titel :
Computing for Sustainable Global Development (INDIACom), 2015 2nd International Conference on
Conference_Location :
New Delhi
Print_ISBN :
978-9-3805-4415-1