• DocumentCode
    707419
  • Title

    Evaluation of scalable 3-D Network on Chip architectures

  • Author

    Tyagi, Sapna ; Agarwal, Amit

  • Author_Institution
    Dept. of Comput. Sci., Inst. of Manage. Studies, Ghaziabad, India
  • fYear
    2015
  • fDate
    11-13 March 2015
  • Firstpage
    1056
  • Lastpage
    1060
  • Abstract
    The increase growth of VLSI technology and consumer demand has enabled future System-on-Chip (SoC) systems to integrate up to several hundreds of cores within a single chip. Due to such enormous integration density and complexity of the system-on-Chip (SoC), the conventional architectures are not suitable to fulfill the demand and scalability issues. The application of traditional network technologies in the form of Network-on-Chip is a potential solution; however it suffers from high speed. In this paper, we have discussed evaluated and proposed some 3-Dimensional scalable architecture for Network-on-Chip that has reduce diameter and degree.
  • Keywords
    VLSI; integration; network-on-chip; three-dimensional integrated circuits; 3-dimensional scalable architecture; SoC systems; VLSI technology; consumer demand; degree reduction; diameter reduction; integration density; scalable 3D network-on-chip architecture evaluation; single chip; system-on-chip systems; Bandwidth; Computer architecture; Network topology; Routing; System-on-chip; Topology; Wires; 3-D; NoC; SoC; Topology; VLSI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computing for Sustainable Global Development (INDIACom), 2015 2nd International Conference on
  • Conference_Location
    New Delhi
  • Print_ISBN
    978-9-3805-4415-1
  • Type

    conf

  • Filename
    7100409