DocumentCode
707864
Title
The use of quartz packaging for SAW-based sensors
Author
Lukyanov, D. ; Shevchenko, S. ; Kukaev, A. ; Filippova, E. ; Khivrich, M.
Author_Institution
Dept. of Laser Meas. & Navig. Syst., St.-Petersburg Electrotech. Univ. “LETI”, St. Petersburg, Russia
fYear
2015
fDate
2-4 Feb. 2015
Firstpage
33
Lastpage
35
Abstract
The importance of the use of silica packing for gyroscopes and accelerometers quartz packaging is demonstrated. Technology of quartz packaging providing the ability to adjust the frequency of the laser resonator and the simultaneous formation of structures on opposite sides of the console using laser is discussed.
Keywords
accelerometers; electronics packaging; gyroscopes; measurement by laser beam; surface acoustic wave resonators; surface acoustic wave sensors; SAW-based sensor; accelerometer quartz packaging; gyroscope; laser resonator; silica packing; Electrodes; Gold; Gyroscopes; Micromechanical devices; Packaging; Substrates; Surface acoustic waves; laser frequency adjustment; micro electromechanical systems (MEMS) micromechanical accelerometer (MMA); quartz packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Young Researchers in Electrical and Electronic Engineering Conference (EIConRusNW), 2015 IEEE NW Russia
Conference_Location
St. Petersburg
Print_ISBN
978-1-4799-7305-7
Type
conf
DOI
10.1109/EIConRusNW.2015.7102226
Filename
7102226
Link To Document