An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages

An in-situ and cost-effective numerical-experimental approach for fatigue characterization of bi-material interfaces in Microelectronic Packages is presented. In this method using a sample-centered approach a Miniaturized Sub-Critical Bending (MSCB) test setup is designed and fabricated based on the samples that are acquired directly from production-line. The accuracy of the results and stiffness of the test-set up is validated using digital image correlation method. The delamination growth is measured using a compliance-based numerical-experimental method under sub-critical cyclic loading. The critical and threshold toughness values being F_C and F_th are measured. The sample are examined after tests using EDX and SEM measurements. The fractographical study of samples shows that, although some of the molding compound particles are left on the LF surface, the interfacial fracture is the dominant failure mode.