The effect of variations in temperature cycling profile and mechanical properties of solder on thermo-mechanical reliability of a lead-free BGA package

Author

Belov, Ilja ; Arwidson, Jonas ; Poder, Ralf ; Johannesson, Par ; Leisner, Peter

Author_Institution

Sch. of Eng., Jonkoping Univ., Jonkoping, Sweden

fYear

2015

fDate

19-22 April 2015

Firstpage

1

Lastpage

5

Abstract

The paper investigates the effect of variations both in temperature cycling profile and in SAC305 solder Young´s modulus in the PBGA256 package on the thermo-mechanical reliability. FE simulations quantify the effect of cycle reduction and counting techniques by introducing different temperature profiles having identical dwell- and period time characteristics. A difference of 30% in predicted accumulated creep strain energy density per cycle has been determined for the studied profiles. Under the provided modelling assumptions and simplifications, the maximum variation of the thermal fatigue life of SAC305 solder joints is within 30% as the result of experimentally determined Young´s modulus variation in as-delivered packages.

Keywords

Young´s modulus; ball grid arrays; circuit reliability; soldering; PBGA256 package; SAC305 solder Young odulus; counting technique; cycle reduction; finite element simulation; lead-free BGA package; lead-free solder; mechanical properties; temperature cycling profile variation; thermo-mechanical reliability; Estimation; Lead; Reliability; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on

Conference_Location

Budapest

Print_ISBN

978-1-4799-9949-1

Type

conf

DOI

10.1109/EuroSimE.2015.7103102

Filename

7103102