• DocumentCode
    708097
  • Title

    Model verification of heat exchangers in a flow test rig

  • Author

    Brinkfeldt, Klas ; Aklint, Thorbjorn ; Neumaier, Klaus ; Zschieschang, Olaf ; Edwards, Michael ; Andersson, Dag

  • Author_Institution
    Swerea IVF, Mölndal, Sweden
  • fYear
    2015
  • fDate
    19-22 April 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In power electronics, more efficient removal of heat from the junction of power devices leads to a higher power rating per die, which in turn leads to fewer die and reduced system volume. Since temperature is a main driver in expected failure modes an increase in cooling capability can also enhance margins of the device reliability.
  • Keywords
    cooling; heat exchangers; heat sinks; power electronics; thermal management (packaging); device reliability; flow test rig; heat exchangers; model verification; power device junction; power electronics; Fluid flow measurement; Reliability; Resistance heating; Switches; Temperature measurement; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4799-9949-1
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2015.7103135
  • Filename
    7103135
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=708097