DocumentCode
708099
Title
Multi-physics modelling of thin films: Optimization for finite elements simulations tools
Author
Youssef, Toni ; Woirgard, Eric ; Azzopardi, Stephane ; Martineau, Donatien ; Meuret, Regis
Author_Institution
IMS Lab., Univ. of Bordeaux, Talence, France
fYear
2015
fDate
19-22 April 2015
Firstpage
1
Lastpage
5
Abstract
This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.
Keywords
cracks; finite element analysis; metallic thin films; nickel; optimisation; shear strength; thermal analysis; Ni; cracks; finite element simulations; mechanical behaviors; multiphysics modelling; optimization; power module; shear strength; thermal analysis; thin films; Computational modeling; Heating; Metallization; Nanoscale devices; Nickel; Optimization; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location
Budapest
Print_ISBN
978-1-4799-9949-1
Type
conf
DOI
10.1109/EuroSimE.2015.7103138
Filename
7103138
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