Title :
A finite element modelling and fracture mechanical approach of Multilayer Ceramic Capacitors
Author :
Al Ahmar, Joseph ; Wiese, Steffen
Author_Institution :
Saarland Univ., Saarbrücken, Germany
Abstract :
A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.
Keywords :
brittle fracture; ceramic capacitors; finite element analysis; fracture mechanics; microcracks; reliability; soldering; thermal shock; ANSYS; board flexing; brittle material behavior; ceramic termination interface; component reliability; finite element model; fracture mechanics; fracture parameters; microcracking; multilayer ceramic capacitors; solder reflow; thermal shock; Kinematics; Load modeling; Temperature; Thermal conductivity; Thermal expansion; Thermal loading;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103147