Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Author

Vandevelde, Bart ; Zanon, Franco ; Griffoni, Alessio ; Xiaolong Li ; Willems, Geert ; Meneghini, Matteo

Author_Institution

imec, Leuven, Belgium

fYear

2015

fDate

19-22 April 2015

Firstpage

1

Lastpage

4

Abstract

The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.

Keywords

assembling; cracks; finite element analysis; integrated circuit reliability; light emitting diodes; printed circuits; soldering; thermal analysis; FEM analysis; PCB Assembly; combined experimental; crack propagation modelling approach; finite element analysis; high-power LED; nonuniform solder joint stand-off height; reliability; solder-joint tilting; thermal cycling experiments; Acceleration; Analytical models; Assembly; Deformable models; Reliability; Strain;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on

Conference_Location

Budapest

Print_ISBN

978-1-4799-9949-1

Type

conf

DOI

10.1109/EuroSimE.2015.7103170

Filename

7103170