Title :
Accelerated degradation testing of coating of PCB under humid heat env
Author :
Xiaoming Ren ; Xiaohui Wang ; Run Zhu
Author_Institution :
Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
Abstract :
Printed circuit board (PCB) is the carrier of electronic components. Its coating is the first barrier for protecting itself. If the coating is damaged, the performance of printed circuit board will decrease rapidly until failure. Therefore, the coating plays an important role to the entire printed circuit board. In this paper, we designed an accelerated degradation test under humid heat environment for a typical kind of coating (Parylene C). And chose insulation resistance, moisture absorption and surface morphology as its test indexes. At last, we estimate the coating´s failure time based on the degradation of insulation resistance.
Keywords :
coatings; humidity; life testing; moisture; printed circuit manufacture; surface morphology; PCB coating; Parylene C coating; accelerated degradation testing; coating failure time; electronic components; humid heat environment; insulation resistance; moisture absorption; printed circuit board; surface morphology; Coatings; Degradation; Fitting; Insulation; Life estimation; Reliability; Stress; Accelerated degradation testing; Parylene C; failure time; humid heat environment;
Conference_Titel :
Reliability and Maintainability Symposium (RAMS), 2015 Annual
Conference_Location :
Palm Harbor, FL
Print_ISBN :
978-1-4799-6702-5
DOI :
10.1109/RAMS.2015.7105094