DocumentCode
70864
Title
Contactless Characterization of a CMOS Integrated LC Resonator for Wireless Power Transferring
Author
Cabrera, Fabian L. ; Rangel de Sousa, F.
Author_Institution
Electr. Eng. Dept., Fed. Univ. of Santa Catarina, Florianopolis, Brazil
Volume
25
Issue
7
fYear
2015
fDate
Jul-15
Firstpage
475
Lastpage
477
Abstract
Miniaturized implanted circuits must be autonomous, harvesting energy from surroundings or receiving power from an inductive link. Considering the latter, when the implant dimensions are limited to few mm 2, the power receiver must be carefully designed so that its efficiency is maximized. If the receiving inductor is integrated in a silicon substrate, a rigorous design methodology should be adopted, because the losses are high, thus degrading the power transmission efficiency. An additional issue arises when such a system needs to be tested, which must happen without invasive techniques. In this article, we describe the contactless characterization of an LC resonator used in an 1.5 mm × 1.5 mm fully integrated wireless power receiver. A quality factor of 20.8 was measured at the resonance frequency 0.99 GHz.
Keywords
CMOS integrated circuits; LC circuits; UHF integrated circuits; inductive power transmission; inductors; radio receivers; CMOS integrated LC resonator; contactless characterization; energy harversting; frequency 0.99 GHz; integrated wireless power receiver; miniaturized implanted circuit; power transmission efficiency; receiving inductor; silicon substrate; wireless power transferring; CMOS integrated circuits; Frequency measurement; Inductors; Q-factor; Resonant frequency; Semiconductor device measurement; Wireless communication; Contactless measurement; inductive link; integrated resonator; seal ring; wireless power transfer;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2015.2427573
Filename
7110407
Link To Document