DocumentCode
708649
Title
Measurement and modeling of IC self-heating including cooling system properties
Author
Nishimura, T. ; Tanoue, H. ; Oodate, Y. ; Mattausch, H.J. ; Miura-Mattausch, M.
Author_Institution
Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
fYear
2015
fDate
23-26 March 2015
Firstpage
90
Lastpage
93
Abstract
Heating and cooling mechanisms under actual IC-operating conditions are investigated experimentally and theoretically. For the investigation different chip packages and cooling-system approaches are studied. Comparison between experimental and theoretical studies concludes that the optimum possible package design is obtained by enhancing both the heat radiation and the air convection at the same time.
Keywords
cooling; heating; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; IC self-heating measurement; IC self-heating modeling; air convection; chip packages; package design; Atmospheric modeling; Cooling; Heating; Length measurement; Mathematical model; Power measurement; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures (ICMTS), 2015 International Conference on
Conference_Location
Tempe, AZ
ISSN
1071-9032
Print_ISBN
978-1-4799-8302-5
Type
conf
DOI
10.1109/ICMTS.2015.7106115
Filename
7106115
Link To Document