Test structures for the wafer mapping and correlation of electrical, mechanical and high frequency magnetic properties of electroplated ferromagnetic alloy films

This paper presents a method of electrically determining the permeability of patterned electroplated structures and brings together the simultaneous wafer mapping of magnetic permeability, electrical resistivity and mechanical strain of electroplated ferromagnetic films together with the thickness of the films and their composition. The wafer mapping of all these properties is implemented using set of simple automated electrical and optical techniques that facilitates the spatial correlation between different parameters. This enables the uniformity of the electrodeposited conductive ferromagnetic films to be analyzed and supports the optimization of both their properties and the technological processes associated with their deposition.