• DocumentCode
    709057
  • Title

    Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature

  • Author

    Ahadi, Majid ; Vempa, Mounica ; Roy, Sourajeet

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
  • fYear
    2015
  • fDate
    15-21 March 2015
  • Firstpage
    350
  • Lastpage
    355
  • Abstract
    In this paper, a novel stochastic collocation approach for the efficient statistical analysis of high-speed interconnect networks within a SPICE environment is proposed. This approach employs the Stroud cubature rules to locate the sparse grid of collocation nodes within the random space where the deterministic SPICE simulations of the network are performed. The major advantage of this approach lies in the fact that the number of collocation nodes scales optimally (i.e. linearly) with the number of random dimensions unlike the exponential or polynomial scaling exhibited by the conventional tensor product grids or the Smolyak sparse grids respectively. This enables the quantification of the statistical moments for interconnect networks involving large random spaces at only a fraction of the typical CPU cost. The validity of this methodology is demonstrated using a numerical example.
  • Keywords
    SPICE; integrated circuit design; integrated circuit interconnections; stochastic processes; SPICE; Stroud cubature rules; collocation nodes; high speed interconnect; multidimensional statistical modeling; sparse grid location; statistical moment quantification; stochastic collocation; Algorithm design and analysis; Computational modeling; Integrated circuit interconnections; Numerical models; Polynomials; SPICE; Stochastic processes; Cubature rules; interconnect networks; statistical moments; stochastic collocation; transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-1992-5
  • Type

    conf

  • DOI
    10.1109/EMCSI.2015.7107713
  • Filename
    7107713