Title :
Multiphysics characterization of large-scale through-silicon-via structures
Author :
Tianjian Lu ; Jian-Ming Jin ; Er-Ping Li
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
The thermal analysis is coupled with the full-wave electromagnetic analysis in order to accurately predict the electrical behaviors of through-silicon-via (TSV) structures. The cosimulation is implemented with the finite element method. A highly efficient domain decomposition scheme is introduced into the co-simulation to handle large-scale massively coupled TSV structures.
Keywords :
circuit simulation; finite element analysis; integrated circuit interconnections; large scale integration; thermal analysis; three-dimensional integrated circuits; finite element method; full-wave electromagnetic analysis; large-scale through-silicon-via structures; thermal analysis; Computational modeling; Electromagnetic analysis; Finite element analysis; Insertion loss; Integrated circuit modeling; Program processors; Thermal analysis; Finite Element Tearing and Interconnecting Multiphysics, Through-Silicon-Via;
Conference_Titel :
Applied Computational Electromagnetics (ACES), 2015 31st International Review of Progress in
Conference_Location :
Williamsburg, VA
