Title :
Effect of silver alloy bonding wire properties on bond strengths and reliability
Author :
Jun Cao ; JunLing Fan ; Zhiqiang Liu ; YueMin Zhang
Author_Institution :
Sch. of Mech. & Power Eng., Henan Polytech. Univ., Jiaozuo, China
Abstract :
In the study, the effect of silver alloy bonding wire properties on bonding strength was evaluated and the IMCs layer growth under these conditions was also discussed. It was found that the Zn elements in silver alloy bonding wire can decrease the coefficient of heat conductivity, the coefficient of heat conductivity is smaller 16%, and avoid to form golf ball and sharp ball. Long HAZ length will cause the ball neck crack and lead to black bonded or failure bonded, Zn elements can increase the recrystallized temperature, then decrease the HAZ length, the HAZ length decreased 25%. After HTS test, cracks phenomenon happens at the bonding interface because of Ag atoms rapidly migrate, Zn can decrease the Ag migrate rate and avoid the crack in bonded interface.
Keywords :
integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; silver alloys; Ag; HAZ length; HTS test; IMC layer; bond reliability; bond strengths; heat conductivity coefficient; silver alloy bonding wire; Bonding; Conductivity; Heating; High-temperature superconductors; Silver; Wires; Frer Air Ball; HAZ; IMC; Zn; silver alloy bonding wire; strength;
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
DOI :
10.1109/ICEP-IAAC.2015.7111008
