DocumentCode
709587
Title
The influence of surface wettability on the ladybird beetles attachment to solid surfaces
Author
Nakamoto, M. ; Urata, C. ; Hozumi, A. ; Suga, T. ; Hosoda, N.
Author_Institution
Interconnect Design Group, Nat. Inst. for Mater. Sci., Tsukuba, Japan
fYear
2015
fDate
14-17 April 2015
Firstpage
149
Lastpage
152
Abstract
The seven-spotted ladybird beetles Coccinella septempunctata(L.) have a hairy adhesive attachment on the foot. They can walk on different surfaces because of the presence of setae on the foot. The beetles secrete an adhesive secretion on the adhesive pads of their legs. In this paper, the measurements of traction force using seven-spotted ladybird beetles Coccinella septempunctata(L.) were carried out to understand the influence of surface wettability on insect attachment to solid surfaces. The experiments were performed on four smooth substrates with different dynamic (contact angle hysteresis(CA)) dewettabilities toward n-hexadecane: (a) Si substrate modified with a perfluoroalkyl silane (FAS3, CF3CH2CH2Si(OCH3)3) monolayer, (b) Si substrate modified with a perfluoroalkyl silane (FAS13, CF3(CF2)5CH2CH2Si(OCH3)3) monolayer, (c) Si substrate modified with a perfluoroalkyl silane (FAS17, CF3(CF2)7CH2CH2Si(OCH3)3) monolayer, (d) glass substrate covered with a decyltrietoxysilane (C10, CH3(CH2)9Si(OC2H5)3). Judging from the traction force data achieved on these substrates, the traction force was governed not by the dynamic dewettability (CA hysteresis).
Keywords
biomimetics; contact angle; force measurement; organic compounds; silicon; wetting; Si; contact angle hysteresis; decyltrietoxysilane; foot; glass substrate modification; hairy adhesive attachment; ladybird beetles Coccinella septempunctata; leg adhesive pads; n-hexadecane; perfluoroalkyl silane monolayer; silicon substrate modification; solid surfaces; surface wettability; traction force measurements; Dynamics; Foot; Force; Hysteresis; Insects; Silicon; Substrates; biomimetics; hysteresis; surfaces free energy; wettability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111017
Filename
7111017
Link To Document