• DocumentCode
    709587
  • Title

    The influence of surface wettability on the ladybird beetles attachment to solid surfaces

  • Author

    Nakamoto, M. ; Urata, C. ; Hozumi, A. ; Suga, T. ; Hosoda, N.

  • Author_Institution
    Interconnect Design Group, Nat. Inst. for Mater. Sci., Tsukuba, Japan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    149
  • Lastpage
    152
  • Abstract
    The seven-spotted ladybird beetles Coccinella septempunctata(L.) have a hairy adhesive attachment on the foot. They can walk on different surfaces because of the presence of setae on the foot. The beetles secrete an adhesive secretion on the adhesive pads of their legs. In this paper, the measurements of traction force using seven-spotted ladybird beetles Coccinella septempunctata(L.) were carried out to understand the influence of surface wettability on insect attachment to solid surfaces. The experiments were performed on four smooth substrates with different dynamic (contact angle hysteresis(CA)) dewettabilities toward n-hexadecane: (a) Si substrate modified with a perfluoroalkyl silane (FAS3, CF3CH2CH2Si(OCH3)3) monolayer, (b) Si substrate modified with a perfluoroalkyl silane (FAS13, CF3(CF2)5CH2CH2Si(OCH3)3) monolayer, (c) Si substrate modified with a perfluoroalkyl silane (FAS17, CF3(CF2)7CH2CH2Si(OCH3)3) monolayer, (d) glass substrate covered with a decyltrietoxysilane (C10, CH3(CH2)9Si(OC2H5)3). Judging from the traction force data achieved on these substrates, the traction force was governed not by the dynamic dewettability (CA hysteresis).
  • Keywords
    biomimetics; contact angle; force measurement; organic compounds; silicon; wetting; Si; contact angle hysteresis; decyltrietoxysilane; foot; glass substrate modification; hairy adhesive attachment; ladybird beetles Coccinella septempunctata; leg adhesive pads; n-hexadecane; perfluoroalkyl silane monolayer; silicon substrate modification; solid surfaces; surface wettability; traction force measurements; Dynamics; Foot; Force; Hysteresis; Insects; Silicon; Substrates; biomimetics; hysteresis; surfaces free energy; wettability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111017
  • Filename
    7111017