Self-linking mechanism of micro solder particles dispersion in liquidus polymer

Author

Yasuda, K. ; Ishida, M.

Author_Institution

Div. of Mater. & Manuf. Sci., Osaka Univ., Suita, Japan

fYear

2015

fDate

14-17 April 2015

Firstpage

157

Lastpage

160

Abstract

In the self-forming micro bump bonding by the solder paste mixed with a low-viscous epoxy thermosetting resin, voids generated during reflow is a drawback since it affects micro bump formation. We investigated the effect of vacuum degassing and pre-treatment of substrate surface with low-pressure plasma on the micro bump formation. Self-forming micro bumps were collectively assembled on the array copper lands of FR-4 substrate with the paste consisting of Sn-57Bi-1Ag solder particles (10, 20 micrometers in diameters) and the resin. Effect of the surface pretreatment conditions on the void generation and bump shape was found to be small. It was suggested that voids originated from the chemical reaction at the interface between the resin and solder powder surface.

Keywords

bismuth compounds; chemical reactions; disperse systems; resins; solders; tin compounds; FR-4 substrate; Sn-Bi-Ag; chemical reaction; liquidus polymer; low-pressure plasma; low-viscous epoxy thermosetting resin; micro solder particle dispersion; self-forming micro bump bonding formation; self-linking mechanism; solder particles; solder paste; solder powder surface; substrate surface pretreatment; vacuum degassing; void generation; Glass; Heating; Plasma temperature; Resins; Substrates; Surface treatment; fusible fillers; hybrid materials; micro particles; self-assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on

Conference_Location

Kyoto

Print_ISBN

978-4-9040-9012-1

Type

conf

DOI

10.1109/ICEP-IAAC.2015.7111019

Filename

7111019