• DocumentCode
    709596
  • Title

    Technology Roadmap overviews and future direction through technology gaps

  • Author

    Bader, Bill ; Richardson, Chuck ; Tsuriya, Masahiro

  • Author_Institution
    Int. Electron. Manuf. Initiative (iNEMI), Herndon, VA, USA
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    219
  • Lastpage
    224
  • Abstract
    The 2015 Technology Roadmap will be released to industry April, 2015. This roadmap like all iNEMI Roadmaps are updated every two years and describe the future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of 6 product segments as well as forecasting the technical evolution associated with 19 different areas that support these product area needs. The resulting gaps are identified between the product needs and technical capabilities. This paper discusses the roadmap highlights and identifies the technical and business gaps and showstoppers to provide in depth assessments, including key drivers from both business and technology viewpoints, critical gaps, and areas of potential industry collaboration moving forward.
  • Keywords
    electronics industry; International Electronics Manufacturing Initiative; global electronics industry; iNEMI roadmaps; manufacturing technology; technology roadmap; Assembly; Consumer electronics; Medical diagnostic imaging; Standards; Substrates; Supply chains; Board Assembly; Final Assemby; Inspection & Measurement; Medical Electronics; Technology Roadmap; Test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111028
  • Filename
    7111028