DocumentCode
709596
Title
Technology Roadmap overviews and future direction through technology gaps
Author
Bader, Bill ; Richardson, Chuck ; Tsuriya, Masahiro
Author_Institution
Int. Electron. Manuf. Initiative (iNEMI), Herndon, VA, USA
fYear
2015
fDate
14-17 April 2015
Firstpage
219
Lastpage
224
Abstract
The 2015 Technology Roadmap will be released to industry April, 2015. This roadmap like all iNEMI Roadmaps are updated every two years and describe the future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of 6 product segments as well as forecasting the technical evolution associated with 19 different areas that support these product area needs. The resulting gaps are identified between the product needs and technical capabilities. This paper discusses the roadmap highlights and identifies the technical and business gaps and showstoppers to provide in depth assessments, including key drivers from both business and technology viewpoints, critical gaps, and areas of potential industry collaboration moving forward.
Keywords
electronics industry; International Electronics Manufacturing Initiative; global electronics industry; iNEMI roadmaps; manufacturing technology; technology roadmap; Assembly; Consumer electronics; Medical diagnostic imaging; Standards; Substrates; Supply chains; Board Assembly; Final Assemby; Inspection & Measurement; Medical Electronics; Technology Roadmap; Test;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111028
Filename
7111028
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