• DocumentCode
    709603
  • Title

    Effects of complexing reagents on electroless nicke l-iron alloy plating for diffusion barrier of UBM

  • Author

    Ja-Kyung Koo ; Jae-Ho Lee

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Hongik Univ., Seoul, South Korea
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    300
  • Lastpage
    303
  • Abstract
    In this research, bath stability and deposition characteristics of electroless Ni-Fe were investigated with variations of sodium citrate concentrations. Complexing agents such as sodium citrate are one of the main components of the electroless plating bath. Since they could play various roles such as maintaining pH stability, preventing precipitation of metal salts, and reducing the concentrations of free metal ions, the concentrations of the complexing agent in the plating bath is an important parameter for electroless deposition processes. In this research, unstable baths were obtained without sufficient sodium citrate concentrations and these phenomena were analyzed. Moreover, deposition characteristics of electroless Ni-Fe for under bump metallurgy (UBM) diffusion barrier were also investigated using energy dispersive spectroscopy (EDS) and field emission scanning electron microscopy (FESEM).
  • Keywords
    circuit stability; diffusion barriers; electroplating; field emission ion microscopy; iron alloys; nickel alloys; pH; precipitation; scanning electron microscopy; sodium compounds; EDS; FESEM; Ni-Fe; UBM; complexing reagent effects; deposition characteristics; diffusion barrier; electroless alloy plating bath; energy dispersive spectroscopy; field emission scanning electron microscopy; free metal ion concentration reduction; metal salt precipitation prevention; pH stability characteristics; under bump metallurgy diffusion barrier; Electric potential; Electrodes; Ions; Nickel; Thermal stability; complexing agent; electroless Ni-Fe; sodium citrate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111035
  • Filename
    7111035