• DocumentCode
    709614
  • Title

    Transfer properties of moth-eye structure film by RTR UV-NIL

  • Author

    Uchida, T. ; Moro, M. ; Hiwasa, S. ; Taniguchi, J.

  • Author_Institution
    Dept. of Appl. Electron., Tokyo Univ. of Sci., Tokyo, Japan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    422
  • Lastpage
    427
  • Abstract
    Anti-reflection (AR) film is very useful for prevention of light reflection on FPDs and solar-cell panel. In particular, AR structure (moth-eye structure) film has high performance on prevention from light reflection. Our previous study reported that anti-reflection structure was fabricated by oxygen ion beam irradiation to glassy carbon (GC) . In this study, we focused on the transfer properties of AR structure film by roll to roll UV nano-imprint lithography (RTR UV-NIL) with replica mold. To obtain the two types of replica molds, two types of photo-curable resin (PARQIT OEX-028-X433-3, Autex Co., Ltd and PAK-01-CL; Toyo Gosei Co. Ltd., Tokyo) were used. These replica molds were fabricated from the GC master mold which was irradiated by oxygen ion beam. We examined the feed speed dependence on RTR UV-NIL using two types replica molds. In addition, we examined the durability of replica mold at the optimum feed speed for transferred AR structure film. As a result, we were able to produce high-performance AR film at a feed speed of 6.0 m/min and we also confirmed no change of transferred film up to 200 imprint times.
  • Keywords
    antireflection coatings; curing; light reflection; moulding; nanolithography; nanophotonics; optical films; oxygen; replica techniques; resins; soft lithography; ultraviolet lithography; FPD; RTR UV-NIL; antireflection film; moth-eye structure film; photocurable resin; replica mold; roll-to-roll UV nanoimprint lithography; solar-cell panel; transfer properties; Feeds; Optical device fabrication; Optical films; Reflectivity; Resins; Scanning electron microscopy; Anti-reflection film; RTR UV-NIL; moth-eye;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111049
  • Filename
    7111049