Room-temperature bonding for hermetic sealing using electroplated Au seal rings with ultra-smooth surface

Author

Kurashima, Yuichi ; Maeda, Atsuhiko ; Takagi, Hideki

Author_Institution

Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan

fYear

2015

fDate

14-17 April 2015

Firstpage

452

Lastpage

455

Abstract

We evaluated room temperature bonding characteristics of electroplated Au surfaces smoothed by lift-off method and imprint method. As a result, smoothed surfaces can make a strong bonding; on the other hand electroplated rough surface make a very weak bonding. In TEM observation, no delamination was observed at the bonding interface, which was bonded at room temperature using a smooth surface replicated by the lift-off process. Hermeticity of bonding interface prepared by smoothed surfaces was evaluated by diaphragm structures. As a result, good hermetic sealing was confirmed using the smooth surface replicated by the lift-off method.

Keywords

bonding processes; electroplating; gold; hermetic seals; rough surfaces; Au; bonding interface; electroplated rough surface; electroplated seal rings; hermetic sealing; imprint method; lift-off method; room-temperature bonding; ultra-smooth surface; Bonding; Gold; Micromechanical devices; Rough surfaces; Silicon; Surface roughness; Surface treatment; Au-Au bonding; hermetic sealing; lift-off; room-temperature bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on

Conference_Location

Kyoto

Print_ISBN

978-4-9040-9012-1

Type

conf

DOI

10.1109/ICEP-IAAC.2015.7111056

Filename

7111056