Heat resistant Bi-Ag-X solders for power IC die attachment

Author

Jenn-Ming Song ; Zhang-Hong Chang

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Chung Hsing Univ., Taichung, Taiwan

fYear

2015

fDate

14-17 April 2015

Firstpage

550

Lastpage

553

Abstract

One of the urgent issues in electronic packaging is the die-attachment technique for high power ICs, which needs to withstand high operation temperature up to 250°C. In this study, the microstructure and mechanical properties of the joints between high temperature Pb-free solders (Bi-11Ag, Bi-Ag-X, Zn-30Sn and Sn-18Sb-5Ag) and Cu substrates were investigated. To evaluate the mechanical performance at elevated temperatures, shear tests from room temperature to 250°C were carried out. Experimental results show that for all the test temperatures, Bi-Ag-X joints exhibited superior shear strength than Bi-11Ag and the others. This can be ascribed to the higher solidus temperature of Bi-Ag system, and the strengthening effect of intermetallic compounds on the joints and the interface as well.

Keywords

copper; integrated circuit packaging; microassembling; power integrated circuits; silver; solders; thermal management (packaging); thermal resistance; tin compounds; zinc compounds; Cu; Sn-Ag; Zn-Sn; heat resistant Bi-Ag-X solders; intermetallic compounds; lead-free solders; mechanical property; microstructure property; power IC die attachment; room temperature; shear strength; shear test; temperature 250 C; Joints; Lead; Microstructure; Powders; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on

Conference_Location

Kyoto

Print_ISBN

978-4-9040-9012-1

Type

conf

DOI

10.1109/ICEP-IAAC.2015.7111075

Filename

7111075