High-Volume-Manufacturing (HVM) of BVA enabled advanced Package-on-Package (PoP)

Bond Via Array (BVA) technology utilizes existing wirebond assembly infrastructure to enable high density vertical interconnects required for next generation electronics products. One area that can benefit from BVA is Package-on-Package (PoP) for memory/processor and other combinations used in mobile electronics applications. PoP provides board space savings by vertically stacking the memory atop the processor package. The close coupling between the stacked components also facilitates reduced power operation. Recent product design trends have furthermore set forth requirements for increased IO count between memory and processor in order to increase bandwidth while reducing operating frequency. BVA enables assembly capability for achieving more than 1000 vertical connections between the memory and processor components in an industry standard PoP outline. This figure more than doubles current PoP assembly capability thereby addressing next generation high IO mobile device demands for increased bandwidth [1]-[3]. In this paper, we will present validation data for BVA high volume manufacturing including optimization of assembly process, yield, test and reliability.