The model optimized of mini packaging for quantum dots photodetector readout

The paper shows the research of readout model optimized and mini packaging for the quantum dots photodetector array. The genetic algorithms are used to quantum dots photodetector modeling for accurate readout photoelectric response signal. Three kinds different equivalent circuit model were compared each other and simulated with Cadence IC design software respectively. We developed CTIA readout structure for the quantum dots photodetector array, the readout noise and different substrate materials has simulated by ADS to minimize noise and interference. Two kinds of silicon interposer, namely via-with-one-line and via-with-four-line, have been compared, and demonstrate the via-with-four-line silicon interposer is better than via-with-one-line silicon. Other interposers such as PCB and ceramic interposers still reduce more crosstalk and suppress noise. We still designed the data acquisition and processing analysis unit system, providing Wi-Fi interface to communicate with the PC software to complete the tasks like data acquisition, digital filtering, spectral display, network communication, human-computer interaction etc. Based on high sensitivity of the quantum dots photodetector, the system integrated has more short integration time (10 us), lower noise, and better ability to resist overflow and large dynamic range.