DocumentCode
709640
Title
Massive spalling in Pb-free solder on co-based surface finishes
Author
Chun-Hao Huang ; Yi-Ling Tsai ; Yu Ting Chang ; Wu, Albert T.
Author_Institution
Dept. of Chem. & Mater. Eng., Nat. Central Univ., Jhongli, Taiwan
fYear
2015
fDate
14-17 April 2015
Firstpage
586
Lastpage
589
Abstract
This paper investigates massive spalling that occurs in the intermetallic compounds at the interfaces between Pb-free SAC 305 and Co-based surface finishes. The SAC 305 solders were reflowed on the Co-based substrates and aged at different conditions. The samples were cross-sectioned to study the interfacial morphology. The occurrence of massive spalling depends on the constituents of the substrates. Shear tests were performed on the samples to evaluate the influence of massive spalling on the mechanical strength of the joints. The results indicated that massive spalling did not deteriorate the joint strength.
Keywords
cobalt alloys; copper alloys; silver alloys; solders; surface finishing; surface morphology; tin alloys; Co; Co-based surface finishes; Pb-free solder; SAC 305 solders; SnAgCu; interfacial morphology; intermetallic compounds; joint strength; massive spalling; mechanical strength; shear tests; Aging; Gold; Joints; Soldering; Substrates; Surface finishing; Surface morphology; Cobalt; massive spalling; shear strenrth; surface finish;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-9040-9012-1
Type
conf
DOI
10.1109/ICEP-IAAC.2015.7111082
Filename
7111082
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