• DocumentCode
    709640
  • Title

    Massive spalling in Pb-free solder on co-based surface finishes

  • Author

    Chun-Hao Huang ; Yi-Ling Tsai ; Yu Ting Chang ; Wu, Albert T.

  • Author_Institution
    Dept. of Chem. & Mater. Eng., Nat. Central Univ., Jhongli, Taiwan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    586
  • Lastpage
    589
  • Abstract
    This paper investigates massive spalling that occurs in the intermetallic compounds at the interfaces between Pb-free SAC 305 and Co-based surface finishes. The SAC 305 solders were reflowed on the Co-based substrates and aged at different conditions. The samples were cross-sectioned to study the interfacial morphology. The occurrence of massive spalling depends on the constituents of the substrates. Shear tests were performed on the samples to evaluate the influence of massive spalling on the mechanical strength of the joints. The results indicated that massive spalling did not deteriorate the joint strength.
  • Keywords
    cobalt alloys; copper alloys; silver alloys; solders; surface finishing; surface morphology; tin alloys; Co; Co-based surface finishes; Pb-free solder; SAC 305 solders; SnAgCu; interfacial morphology; intermetallic compounds; joint strength; massive spalling; mechanical strength; shear tests; Aging; Gold; Joints; Soldering; Substrates; Surface finishing; Surface morphology; Cobalt; massive spalling; shear strenrth; surface finish;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111082
  • Filename
    7111082