• DocumentCode
    709646
  • Title

    Modeling of positional plasma characteristics by inserting body tube of optical emission spectroscopy for plasma assisted atomic layer deposition system

  • Author

    In Joong Kim ; Yong Hyeon Shin ; Ilgu Yun

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    638
  • Lastpage
    641
  • Abstract
    Based on a measurable range of optical emission spectroscopy (OES), the modeling of plasma characteristic is investigated depending on the position of incident angle of OES. In this work, OES is installed in the viewpoint of the plasma assisted atomic layer deposition (PA-ALD) system and plasma characteristic is measured using OES. For the enhancement to obtain the plasma characteristic information, the measurement scheme by inserting body tube in front of optical fiber is developed to receive the limited light of plasma. Since a normal optical fiber is not possible to measure plasma uniformity, the proposed scheme can measure a gap of plasma intensity for each region of a wafer. The detailed analytic model is developed by using the analysis between the plasma intensity and the characteristic of PA-ALD. This scheme can allow us to improve the accuracy of a plasma diagnosis, the detection capability of plasma abnormality and the manufacturability.
  • Keywords
    atomic layer deposition; plasma deposition; plasma diagnostics; body tube insertion; optical emission spectroscopy; optical fiber; plasma assisted atomic layer deposition system; plasma intensity gap measurement; plasma uniformity measurement; positional plasma characteristic modeling; Electron tubes; Optical fibers; Optical variables measurement; Plasma measurements; Plasmas; Semiconductor device measurement; Body Tube component; Modeling; Optical emission spectroscopy (OES); Plasma assisted atomic layer deposition (PA-ALD);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111092
  • Filename
    7111092