• DocumentCode
    709675
  • Title

    Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems

  • Author

    Matsuoka, Seiya ; Yamamoto, Michitaka ; Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • fYear
    2015
  • fDate
    14-17 April 2015
  • Firstpage
    850
  • Lastpage
    853
  • Abstract
    This study investigated the effect of nitrogen (N2) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N2 and Ar+O2 was performed. In the case of Ar+O2 AP plasma treatment, the oxidation of the Au surface (Au2O3) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N2 AP plasma treatment. N2 AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O2 AP plasma treatment (bonding temperature: 150°C).
  • Keywords
    X-ray photoelectron spectra; bonding processes; chemical shift; gold alloys; oxidation; plasma materials processing; AP plasma treatment; Au2O3; X-ray photoelectron spectroscopy; XPS spectra; chemical shift; low temperature Au-Au surface-activated bonding; nitrogen atmospheric-pressure plasma treatment; optical microsystems; oxidation; surface analysis; temperature 150 C; Bonding; Gold; Optical surface waves; Plasma temperature; Surface contamination; Surface treatment; Atmosheric-pressure plasma; Au-Au bonding; Surface-activated bonding; X-ray photoelectron spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9040-9012-1
  • Type

    conf

  • DOI
    10.1109/ICEP-IAAC.2015.7111132
  • Filename
    7111132