DocumentCode :
709675
Title :
Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems
Author :
Matsuoka, Seiya ; Yamamoto, Michitaka ; Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi
Author_Institution :
Univ. of Tokyo, Tokyo, Japan
fYear :
2015
fDate :
14-17 April 2015
Firstpage :
850
Lastpage :
853
Abstract :
This study investigated the effect of nitrogen (N2) atmospheric-pressure (AP) plasma treatment on the Au-Au bonding property. Surface analysis using x-ray photoelectron spectroscopy (XPS) before and after AP plasma treatment with different gases: N2 and Ar+O2 was performed. In the case of Ar+O2 AP plasma treatment, the oxidation of the Au surface (Au2O3) was detected by the chemical shift of the 4f levels in XPS spectra. In contrast, no oxidation of Au surfaces was observed after N2 AP plasma treatment. N2 AP plasma treatment was effective in improving the bondability between Au/Au compared with Ar+O2 AP plasma treatment (bonding temperature: 150°C).
Keywords :
X-ray photoelectron spectra; bonding processes; chemical shift; gold alloys; oxidation; plasma materials processing; AP plasma treatment; Au2O3; X-ray photoelectron spectroscopy; XPS spectra; chemical shift; low temperature Au-Au surface-activated bonding; nitrogen atmospheric-pressure plasma treatment; optical microsystems; oxidation; surface analysis; temperature 150 C; Bonding; Gold; Optical surface waves; Plasma temperature; Surface contamination; Surface treatment; Atmosheric-pressure plasma; Au-Au bonding; Surface-activated bonding; X-ray photoelectron spectroscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-9040-9012-1
Type :
conf
DOI :
10.1109/ICEP-IAAC.2015.7111132
Filename :
7111132
Link To Document :
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