DocumentCode
709814
Title
Substrate and temperature influence on the trap density distribution in high-k III-V MOSFETs
Author
Sereni, G. ; Vandelli, L. ; Cavicchioli, R. ; Larcher, L. ; Veksler, D. ; Bersuker, G.
Author_Institution
DISMI, Univ. of Modena & Reggio Emilia, Modena, Italy
fYear
2015
fDate
19-23 April 2015
Abstract
In this work we apply a new spectroscopic technique based on the simulation of capacitance and conductance measurements to investigate the defect density in high-κ/III-V MOSFETs. This technique exploits the simulation of C-V and G-V curves measured over a wide frequency range to extract the defect density map in the energy-position domain. The technique was used to investigate the role of the substrate material and the temperature on the interfacial and bulk defect distributions in the gate stack in InGaAs MOS capacitors grown on both InP and Si substrate. It was found that the substrate material does not affect the defect density in the gate dielectric stack. Applying the technique to C-V and G-V curves measured at different temperatures allows extracting the relaxation energy of defects, an important parameter connected to their atomic nature.
Keywords
MOS capacitors; MOSFET; capacitance measurement; dielectric materials; electric admittance measurement; gallium arsenide; indium compounds; C-V curve measurement; G-V curve measurement; InGaAs; InP; MOS capacitor; Si; bulk defect distribution; capacitance measurement; conductance measurement; defect density map; energy-position domain; gate dielectric stack; high-k III-V MOSFET; relaxation energy extraction; spectroscopic technique; substrate material; trap density distribution; Capacitance-voltage characteristics; Indium phosphide; Logic gates; MOSFET; Silicon; Substrates; Temperature measurement; C-V and G-V curves; III-V; InGaAs; high-k; interface and border traps; modeling and simulations;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IRPS.2015.7112690
Filename
7112690
Link To Document