Title :
Characterization of time-dependent variability using 32k transistor arrays in an advanced HK/MG technology
Author :
Weckx, P. ; Kaczer, B. ; Chen, C. ; Franco, J. ; Bury, E. ; Chanda, K. ; Watt, J. ; Roussel, Ph J. ; Catthoor, F. ; Groeseneken, G.
Author_Institution :
ESAT-MICAS, Katholieke Univ. Leuven, Leuven, Belgium
Abstract :
Here we show that nFET and pFET time-dependent variability, in addition to the standard time-zero variability, can be fully characterized and projected using a series of measurements on a large test element group (TEG) fabricated in an advanced High-k/Metal Gate (HK/MG) technology, thus allowing us to fully characterize the underlying technology. BTI is shown to follow a bimodal defect-centric behavior, for NBTI related to Interface Layer (IL)(SiO2) and HK trapping and for PBTI related to HK and IL/HK interface trapping. Moreover for the first time, an analytical description of the bimodal total ΔVTH shift is derived, as a special case of the generalized defect-centric distribution, which we derive in this work to accurately describe the tail of the distribution.
Keywords :
MOSFET; high-k dielectric thin films; interface states; negative bias temperature instability; semiconductor device reliability; silicon compounds; IL-HK interface trapping; NBTI; PBTI; SiO2; TEG; advanced HK-MG technology; bimodal defect-centric behavior; bimodal total threshold voltage shift; generalized defect-centric distribution; high-k-metal gate technology; interface layer; large test element group; nFET time-dependent variability; pFET time-dependent variability; standard time-zero variability; transistor arrays; Charge carrier processes; Current measurement; Logic gates; Noise; Noise measurement; Stress; Temperature measurement; Bias temperature instability; bimodal defect-centric; time dependent variability; transistor array;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IRPS.2015.7112702