• DocumentCode
    709824
  • Title

    Mitigating “No trouble found” component returns

  • Author

    Haggag, A. ; Sumikawa, N. ; Shaukat, A. ; Lee, J. K. Jerry ; Aghel, Nick ; Slayman, Charlie

  • Author_Institution
    Freescale Semicond. Inc., Austin, TX, USA
  • fYear
    2015
  • fDate
    19-23 April 2015
  • Abstract
    With VLSI scaling, “no trouble found” or NTF parts passing at the component level, but failing at board level manufacturing testing have increased due to the dominance of soft defects over hard defects. An analysis of networking and DSP NTF components shows outlying behavior in not only product parameters but also on-die process parameters revealing new mitigation opportunities. The resulting yield hit is demonstrated to be minor <;0.5% to catch NTFs that can be >50% component with high debug cost.
  • Keywords
    VLSI; integrated circuit testing; DSP NTF component; VLSI scaling; board level manufacturing testing; hard defect; no trouble found mitigation; on-die process parameter; soft defect; very large scale integration; Digital signal processing; Fabrics; Integrated circuits; Manufacturing; Monitoring; Switches; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IRPS.2015.7112710
  • Filename
    7112710