CPI reliability and EMI benefit for MIM CAP embedded C4 package

The necessity of the Metal-Insulator-Metal Capacitor (MIMCAP) devices that helps electrical performance of integrated circuit (IC) has drastically increased for high performance mobile SoC applications. We investigate the magnitude of intrinsic stress employed onto C4 package depends on the MIMCAP size embedded in Silicon die. It is also found that MIMCAP can mitigate 25% stresses imposed on ULK layer in the back-end-of-line (BEOL) process. Moreover, a keen definition of keep out zone (KOZ), the space between MIMCAP as a stress relaxation, is a critical design factor to suppress potential stresses arisen from the MIMCAP embedded C4 package. In this paper, a finite element analysis (FEA) of strain and stress analysis modeling and the benefits to electromagnetic interference for the MIMCAP embedded C4 package will be discussed from design and reliability perspectives and will show superb EMI characteristics with ondie MIMCAP.