DocumentCode :
709857
Title :
Impact of time-zero and NBTI variability on sub-20nm FinFET based SRAM at low voltages
Author :
Goel, N. ; Dubey, P. ; Kawa, J. ; Mahapatra, S.
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol. Bombay, Mumbai, India
fYear :
2015
fDate :
19-23 April 2015
Abstract :
BSIM-CMG based HSPICE framework is developed for simulating time-zero and Negative Bias Temperature Instability (NBTI) variability of SRAM performance parameters. Time-zero variability of Read Static Noise Margin, Hold Static Noise Margin and Flip-Time for different process corners are simulated. Models used for SPICE simulation are foundry qualified sub-20nm FinFET for two types of 6T SRAM cells, High-Speed and High-Density cells. The Impact of stochastic BTI for DC and AC activity stress on these parameters are studied for relevant worst-case process corner. The impact of Vdd reduction on time-zero and post-BTI SRAM parameter variability is also studied. Critical failure situations are identified.
Keywords :
MOSFET circuits; SPICE; SRAM chips; circuit simulation; failure analysis; integrated circuit noise; negative bias temperature instability; 6T SRAM cells; AC activity stress; BSIM-CMG based HSPICE framework; DC activity stress; FinFET based SRAM; NBTI variability; critical failure situations; flip-time; high-density cells; high-speed cells; hold static noise margin; negative bias temperature instability variability; post-BTI SRAM parameter variability; process corners; read static noise margin; stochastic BTI impact; time-zero variability; Degradation; FinFETs; High definition video; Noise; SRAM cells; Stress; BSIM-CMG; FinFET; Flip-Time; HSPICE; NBTI; Reaction-Diffusion model; SNM; SRAM; Variability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/IRPS.2015.7112783
Filename :
7112783
Link To Document :
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