Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation

Author

Jongwoo Park ; Miji Lee ; Kyunghwan Min ; Choi, J.-K. ; Joo, C.-K. ; Park, S.-C. ; Hanbyul Kang ; Sangwoo Pae

Author_Institution

Syst. LSI Bus., Samsung Electron. Co., Ltd., Yongin, South Korea

fYear

2015

fDate

19-23 April 2015

Abstract

Chip-on-film (COF) reliability with fine Cu metal on the film tape used as inner or outer leads for bonding with Au bump that forms electrical contact in display driver IC (DDI) chip is reported. In COF structure, Cu metal is fabricated by electroplating and its mechanical strength was characterized using bending test. It is found that the reliability of COF relies on the quality of Cu electroplating and interface of bonding joint that was optimized to provide excellent bending test results.

Keywords

bending; copper alloys; driver circuits; electrical contacts; electroplating; gold alloys; integrated circuit packaging; integrated circuit reliability; mechanical strength; solders; surface morphology; tin alloys; Au; CuSn; DDI chip; bending test; bonding joint interface; chip-on-film reliability; display driver IC chip; electrical contact; electroplating; fine pitch COF reliability; inner leads; intermetallic compound formation; mechanical strength; outer leads; surface morphology; Annealing; Films; Lead; Reliability; Tin; COF (chip-on-film); Cu/Sn; Reliability; TEM-SAD (selected area diffraction); bending strength; crack; electroplating; intermetallic compound formation; reliability; void;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium (IRPS), 2015 IEEE International

Conference_Location

Monterey, CA

Type

conf

DOI

10.1109/IRPS.2015.7112791

Filename

7112791