DocumentCode
709874
Title
Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison
Author
Gaudestad, Jan ; Orozco, Antonio ; Chen, Jack
Author_Institution
Neocera, LLC, Beltsville, MD, USA
fYear
2015
fDate
19-23 April 2015
Abstract
Magnetic Current Imaging (MCI) and static Thermal Emission (TE), two commonly used Electrical Fault Isolation (EFI) tools, are compared on their ability to localize a short defect in a mobile device central processing unit (CPU). The short was localized by MCI between two micro bumps below the 100μm thick silicon die while TE detected a thermal signal slightly offset due to laser scribing on the die surface.
Keywords
elemental semiconductors; flip-chip devices; infrared imaging; mobile handsets; reliability; silicon; CPU flipchip; EFI tool; MCI; advanced fault isolation technique comparison; die surface; electrical fault Isolation tool; laser scribing; magnetic current imaging; microbumps; mobile device CPU; mobile device central processing unit; static TE; static thermal emission; thermal imaging; thermal signal; Image resolution; Lenses; Magnetic resonance imaging; SQUIDs; Signal resolution; X-ray lasers; EFI; Electrical Fault Isolation; MCI; Magnetic Current Imaging; TE; Thermal Emission; short;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IRPS.2015.7112801
Filename
7112801
Link To Document